Products

Organic Device Sealant

Contributes to prolonging the service lives of organic devices

With organic EL devices, for example, even a miniscule quantity of water infiltrating the device will lead to the degradation of its organic elements, causing the device to stop emitting light. Sealants prevent water from infiltrating organic devices, which directly contributes to longer service lives for the organic devices.

MORESCO MOISTURE CUT

The product was created by leveraging the technologies for the alteration and combination of macromolecules we developed in our work with hot melt adhesives. It seals the periphery of organic devices to shut out moisture that causes degradation.

MORESCO MOISTURE CUT
Product No. Main component Standard hardening conditions Packing style Merits and
applications
Product guide
(PDF)
WB90US(P) UV hardening epoxy resin compound 6J + 80°C × 1 hour UV Syringe PM-OLED edge sealant (standard)
WB90US-HV UV hardening epoxy resin compound 6J + 80°C × 1 hour UV Syringe PM-OLED edge sealant (high-viscosity)
WB90US(P)-LA UV hardening epoxy resin compound 6J + 80°C × 1 hour UV Syringe PM-OLED edge sealant (hypochloric/low-antimony)
WB90US(E) UV hardening epoxy resin compound (9J), 6J + 80°C × 1 hour UV Syringe For temporary sealing in frit glass bonding